Presented:
Prado-Rivera, R. Computational Design of 2D Materials from Ordered Vacancy Compounds (March 2021). “Graphene and Beyond: From Atoms to Applications Workshop”
Thomas, T., Lopez, K., & Agarwal, A. (2021, March). Polymer composites reinforced with 2D foams.TMS 2021 Annual Conference. Orlando, FL, United States. https://www.tms.org/tms2021
Manohar, V, Bhardwaj, S, Venkatakrishnan, S, Volakis, J. (2021, January). VHF/UHF Tightly Coupled Dipole Array for CubeSats. Proceedings of National Radio Science Meeting (NRSM) – URSI, 2021.
Alam F., Forouzanfar S., Jalal A., & Pala N. (2020, November). ZnO thin film-based flexible biosensor for the continuous monitoring of glucose levels in sweat.Spring/Fall Materials Research Society Meeting. Boston, MA, United States. https://www.mrs.org/meetings-events/fall-meetings-exhibits/2020-mrs-spring-and-fall-meeting
Mohammadnezhad, M., Liu, M., Selopal, G., Navarro, F., Wang, Z., Stansfield, B., Zhao, H., Lai, C.Y., Radu, D., & Rosei, F. (2020, November). Novel synthetic path to ternary and quaternary 2D chalcogenides and optoelectronic applications. Spring/Fall Materials Research Society Meeting. Boston, MA, United States. https://www.mrs.org/meetings-events/fall-meetings-exhibits/2020-mrs-spring-and-fall-meeting
Lai, C.-Y., Liu, M., Chang, C.Y., Selopal, G., & Radu, D. (2020, November). Low dimensional Sulvanite for optoelectronic applications. Fall Materials Research Society Meeting, Boston, MA, United States.
Monshi, M, Camara, J, Bhardwaj, S, Volakis, J, and Raj, P. (2020, July). High-Density Embedded Electronics in Textiles with 3D Flex Package Transfer. IEEE 70th Electronic Components and Technology Conference (ECTC). https://eps.ieee.org/publications/enews/february-2020/549-ectc-2020.html
Vital, D, Gonzales, A, Volakis, J, Alwan, E, Bhardwaj, S. (2020, July). A 2.4-GHz Frugal Dumbbell-Shaped Rectenna Built on Recyclable Substrates. Proceedings of IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting. https://2020apsursi.org/
Raj, P, Monshi, M, Bhardwaj, S, Volakis, J. (2020, July) High-Density Component Integration in Fabrics with Thin Flex Interposers. International Symposium on Antennas and Propagation and North American Radio Science Meeting – Montréal, Québec, Canada. https://2020apsursi.org/
Vital, D; Monshi, M; Bhardwaj, S; Raj, P; Volakis, J. (2020, July). Flexible Ink-Based Interconnects for Textile-Integrated RF Components. International Symposium on Antennas and Propagation and North American Radio Science Meeting – Montréal, Québec, Canada. https://2020apsursi.org/
Sayeed, Y; Venkatakrishnan, S; Monshi, M; Abdulhameed, A; Volakis, J and Raj, P. (2020, June). High-Density Embedded Electronics in Textiles with 3D Flex Package Transfer. 70th Electronic Components and Technology Conference (ECTC). https://eps.ieee.org/publications/enews/february-2020/549-ectc-2020.html
Gonzales, A, Volakis, J, Alwan, E. (2020, June). Sub-Terahertz Antenna Array Packaged in Bio-Compatible Polymer for Fully-Passive Subdermal Sensing. IEEE MTT-S Microwave Biomedical Conference. https://imbioc-ieee.org/
Camara, J, Soroushiani S, Wilding, D, Sayeed, Y, Monshi, M, Volakis, J. (2020, June). Remateable and Deformable Area-Array Interconnects in 3D Smart Wireless Sensor Packages. IEEE 70th Electronic, Components and Technology Conference (ECTC). https://eps.ieee.org/publications/enews/february-2020/549-ectc-2020.html
Sayeed, Y, Venkatakrishnan, S, Monshi, M, Abdulhameed, A, Volakis, J, and Raj, P. (2020, June). 3D Heterogeneous and Flexible Package Integration for Zero-Power Wireless Neural Recording. IEEE 70th Electronic Components and Technology Conference (ECTC). https://eps.ieee.org/publications/enews/february-2020/549-ectc-2020.html
Raj, P; Monshi, M; Bhardwaj, S and Volakis, J. (2020, March). Heterogeneous Package Integration for 5G Systems: Design and Packaging Advances, Gomactech 20, Microelectronics for a New Decade. Global Competition and Near-Peer Challenges, Town and Country Resort, San Diego, CA. http://www.gomactech.net/2020/index.html
Sayeed, Y, Wilding, D, Camara, J, Vital, D, Bhardwaj, S, and Raj, P. (2019, October). Deformable Interconnects with Embedded Devices in Flexible Fan-Out Packages. International Symposium on Microelectronics, 2019, Hynes Memorial Center, Boston. https://www.showsbee.com/fairs/61903-IMAPS-Symposium-2019.html